Njengokwenza uguquko olusezingeni eliphezulu, ukuthuthuka okusheshayo emkhakheni wamandla ahlanzekile kanye ne-semiconductor kanye nokuthuthukiswa kwemboni ye-photovoltaic, ngokusebenza kahle okuphezulu kanye nekhono eliphezulu lokucubungula ukunemba kwamathuluzi edayimane akhula isidingo, kodwa impushana yedayimane yokwenziwa njengeyona nto ebaluleke kakhulu eluhlaza, isifunda sedayimane kanye namandla okubamba i-matrix akulula ukuphila kwethuluzi le-carbide akulula. Ukuze kuxazululwe lezi zinkinga, imboni ngokuvamile isebenzisa idayimane powder surface enamathela ngezinto zensimbi, ukuthuthukisa izici zayo ebusweni, ukuthuthukisa ukuqina, ukuze kuthuthukiswe ikhwalithi jikelele ithuluzi.
Indlela ye-diamond powder surface coating ingaphezulu, okuhlanganisa i-chemical plating, i-electroplating, i-magnetron sputtering plating, i-vacuum evaporation plating, ukusabela kokuqhuma okushisayo, njll., okuhlanganisa ukucwenga kwamakhemikhali nokugqoka ngenqubo evuthiwe, ukugqoka okufanayo, kungalawula ngokunembile ukwakheka nokushuba, izinzuzo ze-coating eyenziwe ngokwezifiso, isibe imboni esetshenziswa kakhulu ubuchwepheshe.
1. amakhemikhali Plating
Ingxube yekhemikhali yempushana yedayimane iwukufaka impushana yedayimane eselashiwe esixazululweni sokunameka ngamakhemikhali, bese ifaka ama-ion ensimbi esixazululweni sokumboza ngesenzo se-ejenti enciphisa isixazululo sekhemikhali enamathelayo, okwenza ukunamathela kwensimbi ecinene. Njengamanje, ingxube yamakhemikhali yedayimane esetshenziswa kakhulu yikhemikhali ye-nickel plating-phosphorus (Ni-P) kanambambili ialloy ivamise ukubizwa ngechemical nickel plating.
01 Ukwakheka kwekhambi lekhemikhali le-nickel Plating
Ukwakheka kwesisombululo samakhemikhali sokucwenga kunomthelela omkhulu ekuqhubekeleni phambili okushelelayo, ukuzinza kanye nekhwalithi yokunamathela yokusabela kwayo kwamakhemikhali. Ngokuvamile iqukethe usawoti oyinhloko, i-ejenti yokunciphisa, i-complexer, i-buffer, i-stabilizer, i-accelerator, i-surfactant nezinye izakhi. Ingxenye yengxenye ngayinye idinga ukulungiswa ngokucophelela ukuze kuzuzwe umphumela omuhle kakhulu wokuhlanganisa.
1, usawoti oyinhloko: ngokuvamile i-nickel sulfate, i-nickel chloride, i-nickel amino sulfonic acid, i-nickel carbonate, njll., indima yayo eyinhloko ukuhlinzeka ngomthombo we-nickel.
2. I-ejenti yokunciphisa: ihlinzeka ngokuyinhloko i-athomu ye-athomu, inciphisa i-Ni2 + kusixazululo se-plating ibe yi-Ni bese iyibeka phezu kwezinhlayiya zedayimane, okuyingxenye ebaluleke kakhulu kwisisombululo sokucwenga. Embonini, i-sodium phosphate yesibili enekhono eliqinile lokunciphisa, izindleko eziphansi kanye nokuzinza okuhle kwe-plating isetshenziswa ikakhulukazi njenge-ejenti yokunciphisa. Uhlelo lokunciphisa lungafinyelela ukufakwa kwamakhemikhali ekushiseni okuphansi nokushisa okuphezulu.
I-3, i-ejenti eyinkimbinkimbi: isixazululo sokumboza singanciphisa imvula, sithuthukise ukuzinza kwesisombululo sokumboza, sinwebe impilo yesevisi yesisombululo se-plating, sithuthukise ijubane lokubeka i-nickel, sithuthukise ikhwalithi yongqimba olunamathelayo, ngokuvamile sebenzisa i-succinin acid, i-citric acid, i-lactic acid namanye ama-asidi e-organic kanye nosawoti wawo.
4. Ezinye izingxenye: i-stabilizer ingavimbela ukubola kwesisombululo se-plating, kodwa ngenxa yokuthi izothinta ukuvela kokusabela kwe-chemical plating, idinga ukusetshenziswa okulinganiselwe; i-buffer ingakhiqiza i-H + ngesikhathi sokusabela kwe-nickel plating yamakhemikhali ukuze kuqinisekiswe ukuzinza okuqhubekayo kwe-pH; i-surfactant inganciphisa i-porosity yokumboza.
02 Inqubo yekhemikhali ye-nickel-plating
I-chemical plating yohlelo lwe-sodium hypophosphate idinga ukuthi i-matrix kumele ibe nomsebenzi othize we-catalytic, futhi indawo yedayimane ngokwayo ayinaso isikhungo somsebenzi we-catalytic, ngakho-ke idinga ukucatshangelwa ngaphambi kokucwetshwa kwamakhemikhali empushana yedayimane. Indlela yendabuko yokwelapha ngaphambilini yokucwenga ngamakhemikhali ukususwa kukawoyela, ukubhodla, ukuzwela kanye nokwenza kusebenze.
(1) Ukususwa kukawoyela, ukugqugquzelwa: ukususwa kukawoyela ngokuyinhloko ukususa uwoyela, amabala nokunye ukungcola okuphilayo ebusweni bempushana yedayimane, ukuze kuqinisekiswe ukulingana nokusebenza kahle kokunamathela okulandelayo. I-coarsening ingakha imigodi emincane nemifantu ebusweni bedayimane, ikhulise ubulukhuni bedayimane, engenzi nje kuphela ukukhangiswa kwe-ion yensimbi kule ndawo, yenze kube lula ukufakwa kwamakhemikhali okulandela kanye ne-electroplating, kodwa futhi yakha izinyathelo ebusweni bedayimane, inikeze izimo ezivumayo zokukhula kwe-chemical plating noma i-electroplating metal deposition.
Ngokuvamile, isinyathelo sokususa uwoyela ngokuvamile sithatha i-NaOH kanye nesinye isixazululo se-alkaline njengesixazululo sokususa uwoyela, futhi ngesinyathelo esiqinile, i-nitric acid kanye nesinye isisombululo se-asidi sisetshenziswa njengesixazululo samakhemikhali angcolile ukuze kufakwe ingaphezulu ledayimane. Ngaphezu kwalokho, lezi zixhumanisi ezimbili kufanele zisetshenziswe ngomshini wokuhlanza we-ultrasonic, osiza ekuthuthukiseni ukusebenza kahle kokususwa kukawoyela wedayimane oyimpuphu kanye nokugqugquzelwa, ukonga isikhathi ekususweni kukawoyela kanye nenqubo yokuwohloka, futhi uqinisekise umphumela wokususwa kukawoyela kanye nenkulumo eqinile,
(2) Ukuzwela kanye nokwenza kusebenze: inqubo yokuzwela kanye nokwenza kusebenze kuyisinyathelo esibaluleke kakhulu kuyo yonke inqubo yokucwenga amakhemikhali, ehlobene ngokuqondile nokuthi i-plating yamakhemikhali ingenziwa yini. Ukuzwela ukukhangisa izinto ezine-oxidized kalula endaweni yempushana yedayimane engenalo ikhono le-autocatalytic. Ukwenziwa kusebenze ukukhangisa i-oxidation ye-hypophosphoric acid nama-ion ensimbi asebenzayo (njenge-metal palladium) ekuncishisweni kwezinhlayiya ze-nickel, ukuze kusheshiswe izinga lokubekwa kokunamathela ebusweni bempushana yedayimane.
Ngokuvamile, isikhathi sokwelashwa sokuzwela kanye nokuvula sifushane kakhulu, ukwakheka kwephuzu ledayimane lensimbi ye-palladium kuncane, i-adsorption ye-coating akwanele, ungqimba olunamathelayo kulula ukuwa noma kunzima ukwenza ukunamathela okuphelele, futhi isikhathi sokwelashwa side kakhulu, kuzodala imfucumfucu yephuzu le-palladium, ngakho-ke, isikhathi esingcono kakhulu sokwelashwa kokuqwashisa futhi 20min3.
(3) I-Chemical nickel plating: inqubo yekhemikhali ye-nickel plating ayithinteki kuphela ukwakheka kwesisombululo sokumboza, kodwa futhi ithintwa izinga lokushisa lesisombululo sokumboza kanye nenani le-PH. Ukushisa kwendabuko okuphezulu kwamakhemikhali e-nickel plating, izinga lokushisa elijwayelekile lizoba ku-80 ~ 85 ℃, ngaphezu kuka-85 ℃ kulula ukubangela ukubola kwesisombululo se-plating, futhi ngaphansi kwezinga lokushisa elingaphansi kuka-85 ℃, ngokushesha izinga lokusabela. Ngenani le-PH, njengoba izinga le-pH likhuphuka izinga lokubekwa kwe-coating lizokhuphuka, kodwa i-pH izophinde ibangele ukwakheka kwenhlabathi kasawoti we-nickel ivimbele izinga lokusabela kwamakhemikhali, ngakho-ke ohlelweni lwekhemikhali ye-nickel plating ngokuthuthukisa ukwakheka kwesisombululo samakhemikhali se-plating kanye nesilinganiso, izimo zenqubo yamakhemikhali, ukulawula izinga lokubeka amakhemikhali, ukuminyana kwe-coating, ukumboza ukugqwala kwedayimane indlela yokuhlangabezana nokugqwala kwe-powder.
Ngaphezu kwalokho, i-coating eyodwa ingase ingafinyeleli ukushuba okufanelekile, futhi kungase kube nama-bubbles, ama-pinholes nezinye iziphambeko, ngakho-ke ukugqoka okuningi kungathathwa ukuze kuthuthukiswe ikhwalithi yokugqoka futhi kwandiswe ukuhlakazwa kwempuphu yedayimane eboshwe.
2. i-electro nickling
Ngenxa yokuba khona kwe-phosphorus kungqimba yokugqoka ngemuva kokufakwa kwe-nickel yamakhemikhali edayimane, kuholela ekuziphatheni kabi kukagesi, okuthinta inqubo yokulayisha isihlabathi yethuluzi ledayimane (inqubo yokulungisa izinhlayiya zedayimane endaweni ye-matrix), ngakho-ke ungqimba lokucwenga ngaphandle kwe-phosphorus lungasetshenziswa ngendlela ye-nickel plating. Umsebenzi othize ukubeka impushana yedayimane esixazululweni esinama-nickel ions, izinhlayiya zedayimane ukuthintana ne-electrode negative yamandla ku-cathode, i-nickel metal block ecwiliswe kusixazululo sokucwenga futhi ixhunywe ne-electrode enamandla ukuze ibe i-anode, ngesenzo se-electrolytic, ama-nickel ions amahhala kusixazululo sokumboza ancishiswa abe ama-athomu endaweni yedayimane ehlanganisayo, futhi i-coating yedayimane ikhula.
01 Ukwakhiwa kwesisombululo sokucwenga
Njengesixazululo se-chemical plating, isixazululo se-electroplating sihlinzeka ikakhulukazi ama-ion ensimbi adingekayo enqubo ye-electroplating, futhi silawula inqubo yokubeka i-nickel ukuze kutholwe ukunamathela kwensimbi edingekayo. Izingxenye zayo eziyinhloko zifaka usawoti omkhulu, i-anode esebenzayo, i-buffer agent, izithasiselo nokunye.
(1) Usawoti oyinhloko: ikakhulukazi kusetshenziswa i-nickel sulfate, i-nickel amino sulfonate, njll. Ngokuvamile, ukuphakama kosawoti oyinhloko, ukusakazeka ngokushesha kwesisombululo se-plating, ukusebenza kahle kwamanje, izinga lokubekwa kwensimbi, kodwa izinhlayiya zokumboza zizoba mahhadlahhadla, futhi ukuncipha kokuhlushwa kukasawoti okuyinhloko, ukuqhutshwa okubi kakhulu kwe-coating, futhi kunzima ukulawula.
(2) I-agent esebenzayo ye-anode: ngoba i-anode ilula ukudlula, kulula ukungahambi kahle kahle, okuthinta ukufana kokusabalalisa kwamanje, ngakho-ke kuyadingeka ukwengeza i-nickel chloride, i-sodium chloride namanye ama-agent njenge-activator ye-anodic ukukhuthaza ukusebenza kwe-anode, ukuthuthukisa ukuminyana kwamanje kwe-anode passivation.
(3) Umenzeli we-buffer: njengesixazululo se-chemical plating, i-ejenti yebhafa ingakwazi ukugcina ukuzinza okuhlobene kwesisombululo sokucwenga kanye ne-cathode pH, ukuze ikwazi ukuguquguquka phakathi kwebanga elivumelekile lenqubo yokufakwa kwe-electroplating. I-ejenti ye-buffer evamile ine-boric acid, i-acetic acid, i-sodium bicarbonate nokunye.
(4) Ezinye izithasiselo: ngokwezidingo zokumboza, engeza inani elifanele le-ejenti ekhanyayo, i-ejenti yokulinganisa, i-ejenti yokumanzisa kanye ne-agent exubile nezinye izithasiselo ukuze kuthuthukiswe ikhwalithi yokugqoka.
02 Ukugeleza kwe-nickel ye-Diamond electroplated
1. Ukwelashwa ngaphambi kokucwetshwa: Idayimane ngokuvamile alikwazi ukuhambisa, futhi lidinga ukugqitshwa ngongqimba lwensimbi ngokusebenzisa ezinye izinqubo zokumboza. Indlela ye-Chemical Plating ivame ukusetshenziselwa ukunamathisela ngaphambili ungqimba lwensimbi futhi lujiye, ngakho ikhwalithi yokunameka kwamakhemikhali izothinta ikhwalithi yongqimba lwe-plating ngokwezinga elithile. Ngokuvamile, okuqukethwe phosphorus in the enamathela emva amakhemikhali Plating kunomthelela omkhulu izinga enamathela, futhi high phosphorus enamathela has kuqhathaniswa kangcono ukugqwala ukumelana endaweni acidic, indawo enamathelayo has more isimila iqhuqhuva, amadlangala enkulu ebusweni futhi ayikho impahla kazibuthe; i-medium phosphorus enamathela inokubili ukumelana nokugqwala nokumelana nokugqoka; ukumbozwa kwe-phosphorus okuphansi kune-conductivity engcono kakhulu.
Ngaphezu kwalokho, usayizi wezinhlayiyana ezincane ze-powder idayimane, indawo ekhudlwana yendawo ethize, lapho i-coating, kulula ukuntanta kusixazululo se-plating, izokhiqiza ukuvuza, ukugqoka, ukumboza into engavamile yongqimba, ngaphambi kokucwenga, udinga ukulawula okuqukethwe kwe-P kanye nekhwalithi yokugqoka, ukulawula ukuqhutshwa nokuminyana kwedayimane powder ukuthuthukisa impushana ukuntanta kalula.
2, i-nickel plating: okwamanje, i-diamond powder plating ivamise ukusebenzisa indlela yokugoqa, okungukuthi, inani elifanele lesixazululo se-electroplating liyengezwa ebhodleleni, inani elithile lempushana yedayimane yokwenziwa kusixazululo se-electroplating, ngokujikeleza kwebhodlela, shayela impushana yedayimane ebhodleleni ukuze igingqike. Ngesikhathi esifanayo, i-electrode enhle ixhunywe ne-nickel block, futhi i-electrode engalungile ixhunywe ne-diamond powder yokwenziwa. Ngaphansi kwesenzo senkundla kagesi, ama-nickel ions akhululekile kusixazululo sokucwenga enza insimbi ye-nickel ebusweni bempushana yedayimane yokwenziwa. Kodwa-ke, le ndlela inezinkinga zokusebenza kahle kwe-coating ne-coating engalingani, ngakho-ke indlela ye-electrode ejikelezayo yaba khona.
Indlela ye-electrode ejikelezayo iwukuzungezisa i-cathode ekucwecweni kwempuphu yedayimane. Le ndlela ingandisa indawo yokuxhumana phakathi kwezinhlayiya ze-electrode nedayimane, ikhulise ukuguquguquka okufanayo phakathi kwezinhlayiya, ithuthukise into engalingani yokugqoka, futhi ithuthukise ukusebenza kahle kokukhiqizwa kwe-diamond nickel plating.
isifinyezo esifushane
Njengento yokusetshenziswa eyinhloko yamathuluzi edayimane, ukuguqulwa kwendawo engaphezulu kwe-micropowder yedayimane kuyindlela ebalulekile yokuthuthukisa amandla okulawula i-matrix nokwenza ngcono impilo yesevisi yamathuluzi. Ukuze kuthuthukiswe izinga lokulayishwa kwesihlabathi samathuluzi edayimane, ungqimba lwe-nickel ne-phosphorus ngokuvamile lungagqitshwa phezu kwe-micropowder yedayimane ukuze kube nokuqhutshwa okuthile, bese kushuba ungqimba lokucwenga nge-nickel plating, futhi kuthuthukise ukuhamba kahle. Kodwa-ke, kufanele kuqashelwe ukuthi indawo yedayimane ngokwayo ayinaso isikhungo esisebenzayo se-catalytic, ngakho-ke idinga ukucatshangelwa ngaphambi kokufakwa kwamakhemikhali.
imibhalo eyinkomba:
U-Liu Han. Ukufunda ngobuchwepheshe bokumboza phezulu kanye nekhwalithi yempushana yedayimane yokwenziwa [D]. I-Zhongyuan Institute of Technology.
Yang Biao, Yang Jun, kanye no-Yuan Guangsheng. Ucwaningo ngenqubo yokwelashwa kwangaphambili kokumbozwa kwendawo yedayimane [J]. Ukumiswa kwendawo yesikhala.
Li Jinghua. Ucwaningo ngokuguqulwa kwendawo kanye nokusetshenziswa kwempushana encane yedayimane yokwenziwa esetshenziselwa isaha locingo [D]. I-Zhongyuan Institute of Technology.
UFang Lili, uZheng Lian, uWu Yanfei, et al. I-Chemical nickel Plating inqubo yendawo yedayimane yokwenziwa [J]. Ijenali ye-IOL.
Lesi sihloko siphrintwe kabusha kunethiwekhi yezinto eziqinile
Isikhathi sokuthumela: Mar-13-2025
