Njengoba ukukhiqiza kuye ekuguqulweni okuphezulu, intuthuko esheshayo emkhakheni wamandla ahlanzekile kanye nentuthuko yezimboni ze-semiconductor kanye ne-photovoltaic, ngokusebenza kahle okuphezulu kanye nekhono lokucubungula ngokunemba okuphezulu kwamathuluzi edayimane, isidingo sikhula, kodwa i-powder yedayimane yokwenziwa njengezinto ezisetshenziswa kakhulu, isifunda sedayimane kanye namandla okubamba ama-matrix ayinamandla, impilo yamathuluzi e-carbide asekuqaleni ayinde. Ukuze kuxazululwe lezi zinkinga, imboni ngokuvamile isebenzisa i-coating surface powder yedayimane ngezinto zensimbi, ukuthuthukisa izici zayo zobuso, ukuthuthukisa ukuqina, ukuze kuthuthukiswe ikhwalithi iyonke yamathuluzi.
Indlela yokumboza ubuso bedayimane powder ingaphezu kwalokho, kufaka phakathi i-chemical plating, i-electroplating, i-magnetron sputtering plating, i-vacuum evaporation plating, ukusabela okushisayo, njll., kufaka phakathi i-chemical plating kanye ne-plating ngenqubo evuthiwe, i-coating efanayo, ingalawula ngokunembile ukwakheka kwe-coating kanye nobukhulu, izinzuzo ze-coating ezenziwe ngokwezifiso, isibe ubuchwepheshe obusetshenziswa kakhulu embonini.
1. ukubekwa kwamakhemikhali
Ukufakwa kwamakhemikhali e-powder yedayimane ukufaka i-powder yedayimane ephathwayo esixazululweni sokufakwa kwamakhemikhali, bese kufakwa ama-ion ensimbi esixazululweni sokufakwa ngokusebenzisa isenzo se-reducing agent esixazululweni sokufakwa kwamakhemikhali, kwakha ukuhlanganiswa kwensimbi okuqinile. Njengamanje, ukufakelwa kwamakhemikhali edayimane okusetshenziswa kakhulu yi-chemical nickel plating-phosphorus (Ni-P) binary alloy ngokuvamile ibizwa ngokuthi i-chemical nickel plating.
01 Ukwakheka kwesisombululo se-nickel plating samakhemikhali
Ukwakheka kwesixazululo sokumboza amakhemikhali kunethonya elibalulekile ekuqhubekeni okubushelelezi, ukuzinza kanye nekhwalithi yokumboza yokusabela kwamakhemikhali. Ngokuvamile kuqukethe usawoti oyinhloko, i-reducing agent, i-complexer, i-buffer, i-stabilizer, i-accelerator, i-surfactant nezinye izingxenye. Ingxenye yengxenye ngayinye idinga ukulungiswa ngokucophelela ukuze kufezwe umphumela omuhle kakhulu wokumboza.
1, usawoti oyinhloko: ngokuvamile i-nickel sulfate, i-nickel chloride, i-nickel amino sulfonic acid, i-nickel carbonate, njll., indima yayo eyinhloko ukuhlinzeka ngomthombo we-nickel.
2. I-ejenti yokunciphisa: ihlinzeka kakhulu nge-athomu hydrogen, inciphisa i-Ni2 + esixazululweni sokufaka i-Ni bese iyibeka phezu kwezinhlayiya zedayimane, okuyingxenye ebaluleke kakhulu esixazululweni sokufaka i-Ni. Embonini, i-sodium secondary phosphate enekhono lokunciphisa elinamandla, izindleko eziphansi kanye nokuqina okuhle kokufaka i-Ni isetshenziswa kakhulu njenge-ejenti yokunciphisa. Uhlelo lokunciphisa lungafinyelela ukufakelwa kwamakhemikhali ekushiseni okuphansi kanye nasekushiseni okuphezulu.
3, i-ejenti eyinkimbinkimbi: ikhambi lokumboza linganciphisa imvula, lithuthukise ukuzinza kwekhambi lokumboza, landise impilo yesevisi yekhambi lokumboza, lithuthukise ijubane lokufakwa kwe-nickel, lithuthukise ikhwalithi yesendlalelo sokumboza, ngokuvamile lisebenzisa i-succinin acid, i-citric acid, i-lactic acid kanye namanye ama-organic acid kanye nosawoti wawo.
4. Ezinye izingxenye: isiqinisi singavimbela ukubola kwesisombululo se-plating, kodwa ngoba sizothinta ukwenzeka kokusabela kwe-chemical plating, sidinga ukusetshenziswa okulinganiselwe; i-buffer ingakhiqiza i-H + ngesikhathi sokusabela kwe-chemical nickel plating ukuqinisekisa ukuzinza okuqhubekayo kwe-pH; i-surfactant inganciphisa i-porous yokumboza.
02 Inqubo yokufakelwa kwe-nickel ngamakhemikhali
Ukufakwa kwamakhemikhali ohlelweni lwe-sodium hypophosphate kudinga ukuthi i-matrix kumele ibe nomsebenzi othile wokwenza izinto zibe lula, kanti ubuso bedayimane ngokwalo abunawo umsebenzi wokwenza izinto zibe lula, ngakho-ke kudingeka ukuthi kulungiswe kusengaphambili ngaphambi kokufakwa kwamakhemikhali kompuphu wedayimane. Indlela yendabuko yokwenziwa kwezinto zamakhemikhali ukususa uwoyela, ukugoqa, ukuzwela kanye nokwenza izinto zibe lula.
(1) Ukususwa kwamafutha, ukugoqa: Ukususwa kwamafutha ngokuyinhloko kuhloselwe ukususa uwoyela, amabala kanye nezinye izinto ezingcolisayo eziphilayo ebusweni bempuphu yedayimane, ukuqinisekisa ukulingana okuseduze nokusebenza kahle koqweqwe olulandelayo. Ukugoqa kungakha imigodi emincane kanye nemifantu ebusweni bedayimane, kwandise ubulukhuni bomphezulu wedayimane, okungagcini nje ngokusiza ekumuncweni kwama-ion ensimbi kule ndawo, kwenze kube lula ukugoqa kwamakhemikhali okulandelayo kanye nokugoqa, kodwa futhi kwakha izinyathelo ebusweni bedayimane, okuhlinzeka ngezimo ezinhle zokukhula kokugoqa kwamakhemikhali noma ukugoqa kwensimbi nge-electroplating.
Ngokuvamile, isinyathelo sokususa uwoyela sivame ukuthatha i-NaOH kanye nesinye isisombululo se-alkaline njengesixazululo sokususa uwoyela, futhi ngesinyathelo sokuhlanganisa, i-nitric acid kanye nesinye isisombululo se-asidi kusetshenziswa njengesixazululo samakhemikhali aluhlaza ukuze kuqoshwe ubuso bedayimane. Ngaphezu kwalokho, lezi zixhumanisi ezimbili kufanele zisetshenziswe nomshini wokuhlanza we-ultrasonic, osiza ekuthuthukiseni ukusebenza kahle kokususa uwoyela we-diamond powder kanye nokuhlanganisa, konge isikhathi enkambisweni yokususa uwoyela kanye nokuhlanganisa, futhi kuqinisekiswe umphumela wokususa uwoyela kanye nokukhuluma okungcolile,
(2) Ukuzwela kanye nokwenza kusebenze: inqubo yokuzwela kanye nokwenza kusebenze iyisinyathelo esibaluleke kakhulu kuyo yonke inqubo yokuzwela amakhemikhali, okuhlobene ngqo nokuthi ukuzwela amakhemikhali kungenziwa yini. Ukuzwela ukumunca izinto ezifakwe i-oxid kalula ebusweni be-diamond powder engenawo amandla okuzenzakalelayo. Ukuzwela ukumunca ukuzwela kwe-hypophosphoric acid kanye nama-ion ensimbi asebenzayo (njenge-metal palladium) ekunciphiseni kwezinhlayiya ze-nickel, ukuze kusheshiswe izinga lokufakwa kokumboza ebusweni be-diamond powder.
Ngokuvamile, isikhathi sokwelashwa kokuzwela kanye nokuvuselela sifushane kakhulu, ukwakheka kwephuzu lensimbi yedayimane ye-palladium kuncane, ukumuncwa kwepheshana akwanele, ungqimba lwepheshana kulula ukuwa noma kunzima ukwakha ipheshana eliphelele, kanti isikhathi sokwelashwa side kakhulu, kuzodala ukuchithwa kwephuzu le-palladium, ngakho-ke, isikhathi esingcono kakhulu sokwelashwa kokuzwela kanye nokuvuselela singu-20 ~ 30min.
(3) I-Chemical nickel plating: inqubo ye-chemical nickel plating ayithintwa nje kuphela ukwakheka kwesisombululo sokumboza, kodwa futhi ithinteka yizinga lokushisa lesisombululo sokumboza kanye nenani le-PH. I-Chemical nickel plating yendabuko yokushisa okuphezulu, izinga lokushisa elijwayelekile lizoba ku-80 ~ 85℃, kube lula ukubangela ukubola kwesisombululo sokumboza, futhi ezingeni lokushisa eliphansi kune-85℃, izinga lokusabela lizoshesha. Ngenani le-PH, njengoba izinga lokufakwa kwe-pH lizokhuphuka, kodwa i-pH izophinde ibangele ukwakheka kwe-sediment kasawoti we-nickel kuvimbele izinga lokusabela kwamakhemikhali, ngakho-ke enkambisweni ye-chemical nickel plating ngokwenza ngcono ukwakheka kwesisombululo sokumboza kwamakhemikhali kanye nesilinganiso, izimo zenqubo yokumboza kwamakhemikhali, lawula izinga lokufakwa kwe-chemical coating, ubuningi bokumboza, ukumelana nokugqwala kokumboza, indlela yokumboza ubuningi, i-diamond powder yokumboza ukuze kuhlangatshezwane nesidingo sentuthuko yezimboni.
Ngaphezu kwalokho, uqweqwe olulodwa lungase lungafinyeleli ubukhulu obufanele boqweqwe, futhi kungase kube namabhamuza, ama-pinhole kanye nezinye izinkinga, ngakho-ke uqweqwe oluningi lungasetshenziswa ukuthuthukisa ikhwalithi yoqweqwe futhi kwandiswe ukusabalala kwempuphu yedayimane eboshwe.
2. i-electro nickelling
Ngenxa yokuba khona kwe-phosphorus kungqimba lokumboza ngemva kokufakwa kwe-nickel yamakhemikhali edayimane, kuholela ekuqhutshweni kahle kukagesi, okuthinta inqubo yokulayisha isihlabathi sethuluzi ledayimane (inqubo yokulungisa izinhlayiya zedayimane ebusweni be-matrix), ngakho-ke ungqimba lokumboza olungenayo i-phosphorus lungasetshenziswa ngendlela yokufakwa kwe-nickel. Umsebenzi othize ukufaka i-powder yedayimane kusisombululo sokumboza esiqukethe ama-ion e-nickel, izinhlayiya zedayimane zithintane ne-electrode enamandla angenayo ku-cathode, ibhlogo lensimbi ye-nickel licwiliswe kusisombululo sokumboza futhi lixhunywe ne-electrode enamandla ukuze libe yi-anode, ngesenzo se-electrolytic, ama-ion e-nickel yamahhala kusisombululo sokumboza ancishiswa abe ama-athomu ebusweni bedayimane, futhi ama-athomu akhula abe yi-coating.
01 Ukwakheka kwesisombululo se-plating
Njengesixazululo sokumboza amakhemikhali, isisombululo sokumboza nge-electro sihlinzeka kakhulu ngama-ion ensimbi adingekayo enkambisweni yokumboza nge-electro, futhi silawula inqubo yokumboza nge-nickel ukuze kutholakale ukumboza kwensimbi okudingekayo. Izingxenye zayo eziyinhloko zifaka usawoti oyinhloko, i-agent esebenzayo ye-anode, i-agent ye-buffer, izithasiselo njalo njalo.
(1) Usawoti oyinhloko: ikakhulukazi usebenzisa i-nickel sulfate, i-nickel amino sulfonate, njll. Ngokuvamile, lapho ukugcwala kukasawoti oyinhloko kuphakeme, ukusabalala kwesisombululo sokufaka izinsimbi kushesha, kulapho ukusebenza kahle kwamanje kukhuphuka khona, izinga lokufakwa kwensimbi likhuphuka, kodwa izinhlamvu zokumboza zizoba zimbi kakhulu, kanye nokwehla kokugcwala kukasawoti oyinhloko, ukuqhutshwa komoya okubi kakhulu kokumboza, futhi kube nzima ukulawula.
(2) I-Anode active agent: ngoba i-anode kulula ukuyidlulisa, kulula ukuyidlulisa ekuqhutshweni kwayo, okuthinta ukufana kokusatshalaliswa kwamanje, ngakho-ke kuyadingeka ukwengeza i-nickel chloride, i-sodium chloride kanye nezinye izinto njenge-anodic activator ukukhuthaza ukusebenza kwe-anode, ukuthuthukisa ubuningi bamanje be-anode passivation.
(3) I-Buffer agent: njengesixazululo se-chemical plating, i-buffer agent ingagcina ukuzinza okulinganiselwe kwesisombululo se-plating kanye ne-cathode pH, ukuze ikwazi ukushintshashintsha ngaphakathi kobubanzi obuvunyelwe benqubo ye-electroplating. I-common buffer agent ine-boric acid, i-acetic acid, i-sodium bicarbonate njalo njalo.
(4) Ezinye izithasiselo: ngokwezidingo zesembozo, engeza inani elifanele le-ejenti ekhanyayo, i-ejenti yokulinganisa, i-ejenti yokumanzisa kanye ne-ejenti ehlukahlukene kanye nezinye izithasiselo ukuze kuthuthukiswe ikhwalithi yesembozo.
02 Ukugeleza kwe-nickel okufakwe ngogesi kwedayimane
1. Ukwelashwa ngaphambi kokufaka i-plating: idayimane ngokuvamile ayisebenzi kahle, futhi idinga ukufakwa ungqimba lwensimbi ngezinye izinqubo zokumboza. Indlela yokumboza ngamakhemikhali ivame ukusetshenziselwa ukufaka ungqimba lwensimbi kusengaphambili futhi iqine, ngakho-ke ikhwalithi yokumboza ngamakhemikhali izothinta ikhwalithi yengqimba yokumboza ngezinga elithile. Ngokuvamile, okuqukethwe yi-phosphorus embozweni ngemva kokufaka amakhemikhali kunomthelela omkhulu ekhwalithini yokumboza, kanti ukumboza okuphezulu kwe-phosphorus kunokumelana nokugqwala okungcono kakhulu endaweni ene-asidi, ubuso bokumboza bunokuvuvukala okukhulu kwesimila, ubulukhuni obukhulu bomphezulu futhi abunawo amandla kazibuthe; ukumboza okuphakathi kwe-phosphorus kunokumelana nokugqwala kanye nokumelana nokuguguleka; ukumboza okuphansi kwe-phosphorus kunokuqhuba okungcono kakhulu.
Ngaphezu kwalokho, uma usayizi wezinhlayiya zempuphu yedayimane uncane, kulapho indawo ethile yobuso iba nkulu khona, lapho kufakwa indwangu, kulula ukuyintanta esixazululweni sokuntanta, kuzokhiqiza ukuvuza, ukuntanta, ukuntanta ungqimba olukhululekile, ngaphambi kokufaka indwangu, kudingeka ulawule okuqukethwe kwe-P kanye nekhwalithi yokuntanta, ukulawula ukuhanjiswa kanye nobuningi bempuphu yedayimane ukuze kuthuthukiswe i-powder okulula ukuyintanta.
2, i-nickel plating: njengamanje, i-diamond powder plating ivame ukusebenzisa indlela yokugoqa, okungukuthi, inani elifanele lesisombululo se-electroplating liyangezwa ebhodleleni, inani elithile le-diamond powder yokwenziwa lifakwe esixazululweni se-electroplating, ngokujikeleza kwebhodlela, liqhube i-diamond powder ebhodleleni ukuze ligingqike. Ngesikhathi esifanayo, i-electrode enhle ixhunywe ne-nickel block, futhi i-electrode engemihle ixhunywe ne-diamond powder yokwenziwa. Ngaphansi kwesenzo sensimu kagesi, ama-ion e-nickel akhululekile esixazululweni se-plating akha i-nickel yensimbi ebusweni be-diamond powder yokwenziwa. Kodwa-ke, le ndlela inezinkinga zokusebenza kahle okuphansi kokugoqa kanye nokugoqa okungalingani, ngakho-ke indlela ye-electrode ejikelezayo yaqala ukuba khona.
Indlela ye-electrode ejikelezayo iwukuzungeza i-cathode ku-diamond powder plating. Le ndlela ingandisa indawo yokuxhumana phakathi kwe-electrode nezinhlayiya zedayimane, yandise ukuhanjiswa okufanayo phakathi kwezinhlayiya, ithuthukise ukungalingani kokumboza, futhi ithuthukise ukusebenza kahle kokukhiqizwa kwe-diamond nickel plating.
isifinyezo esifushane
Njengezinto eziyinhloko zokusetshenziswa kwamathuluzi edayimane, ukuguqulwa kobuso bedayimane micropowder kuyindlela ebalulekile yokuthuthukisa amandla okulawula i-matrix nokuthuthukisa impilo yenkonzo yamathuluzi. Ukuze kuthuthukiswe izinga lokulayisha isihlabathi kwamathuluzi edayimane, ungqimba lwe-nickel ne-phosphorus ngokuvamile lungafakwa phezu kobuso bedayimane micropowder ukuze lube nokuqhuba okuthile, bese luqina ungqimba lwe-plating nge-nickel plating, futhi luthuthukise ukuqhuba. Kodwa-ke, kufanele kuqashelwe ukuthi ubuso bedayimane ngokwalo abunaso isikhungo esisebenzayo se-catalytic, ngakho-ke kudingeka siphathwe kusengaphambili ngaphambi kokufaka amakhemikhali.
imibhalo yokubhekisela:
ULiu Han. Ucwaningo ngobuchwepheshe bokumboza ubuso kanye nekhwalithi yempuphu encane yedayimane yokwenziwa [D]. I-Zhongyuan Institute of Technology.
UYang Biao, uYang Jun, noYuan Guangsheng. Ucwaningo ngenqubo yokwelashwa kwangaphambi kokumbozwa kobuso bedayimane [J]. Ukumiswa kwesikhala sesikhala.
ULi Jinghua. Ucwaningo ngokuguqulwa kobuso kanye nokusetshenziswa kwempuphu encane yedayimane yokwenziwa esetshenziselwa isaha lentambo [D]. I-Zhongyuan Institute of Technology.
UFang Lili, uZheng Lian, uWu Yanfei, nabanye. Inqubo yokubopha i-nickel yamakhemikhali ebusweni bedayimane yokwenziwa [J]. Ijenali ye-IOL.
Lesi sihloko siphinde sanyatheliswa kunethiwekhi yezinto eziqinile kakhulu
Isikhathi sokuthunyelwe: Mashi-13-2025
